The aluminum substrate is a metal-based copper clad laminate with good heat dissipation function. Generally, the single panel is composed of a three-layer structure, which is a circuit layer (copper foil), an insulating layer and a metal base layer. Also used for high-end use is designed as a double panel, the structure is circuit layer, insulation layer, aluminum base, insulation layer, circuit layer. A very small number of applications are multi-layer boards, which can be made of ordinary multi-layer boards combined with an insulating layer and an aluminum base.
The LED aluminum substrate is the PCB, which is also the meaning of the printed circuit board. The material of the circuit board is aluminum alloy. In the past, the material of our general circuit board was glass fiber, but because the LED heat is large, the circuit board for LED lamps is generally Aluminum substrate, capable of fast heat conduction, circuit board for other equipment or electrical appliances or fiberglass board.
The surface of the power device is mounted on the circuit layer, and the heat generated during operation of the device is quickly conducted to the metal base layer through the insulating layer, and then the heat is transferred by the metal base layer to achieve heat dissipation of the device.
Compared with the conventional FR-4, the aluminum substrate can minimize the thermal resistance and make the aluminum substrate have excellent thermal conductivity. Compared with the thick film ceramic circuit, its mechanical properties are extremely excellent.
In addition, aluminum substrates have the following unique advantages:
Meet RoHs requirements;
More suitable for SMT process;
Extremely effective treatment of thermal diffusion in the circuit design, thereby reducing module operating temperature, extending service life, increasing power density and reliability;
Reduce the assembly of heat sinks and other hardware (including thermal interface materials), reduce product size, reduce hardware and assembly costs; optimize power circuit and control circuit combination;
Replace the fragile ceramic substrate for better mechanical durability.
Aluminum substrate (metal-based heat sink (including aluminum substrate, copper substrate, iron substrate)) is a low-alloyed Al-Mg-Si high-plastic alloy plate (see the figure below), which has good thermal conductivity and electrical insulation. Performance and machinability, the aluminum substrate is the same thickness and the same line width compared with the traditional FR-4. The aluminum substrate can carry higher current. The aluminum substrate can withstand voltage up to 4500V and the thermal conductivity is greater than 2.0. The industry is dominated by aluminum substrates.
● Surface Mount Technology (SMT);
Street lamp aluminum substrate
Street lamp aluminum substrate
● extremely efficient treatment of thermal diffusion in circuit design;
● Reduce product operating temperature, increase product power density and reliability, and extend product life;
● Reduce product size and reduce hardware and assembly costs;
● Replace the fragile ceramic substrate for better mechanical durability. structure
The aluminum-based copper clad laminate is a metal circuit board material composed of a copper foil, a thermally conductive insulating layer and a metal substrate, and its structure is divided into three layers:
Cireuitl.Layer circuit layer: equivalent to ordinary PCB copper clad, line copper foil thickness loz to 10oz.
DielcctricLayer insulation: The insulation is a low thermal resistance thermal insulation material. The thickness is from 0.003" to 0.006" inches, which is the core technology of aluminum-based copper clad laminates and has obtained UL certification.
BaseLayer base: It is a metal substrate, usually aluminum or copper. Aluminum-based copper clad laminates and conventional epoxy glass cloth laminates.
PCB materials have advantages that are unmatched by other materials. Suitable for power component surface mount SMT public art. No need for a heat sink, greatly reduced size, excellent heat dissipation, good insulation and mechanical properties.