Developed in 1970s, Aluminum PCBs began to be prevalent since their first application in power amplification hybrid ICs (Integrated Circuits). Recent years have witnessed increasingly wide applications and development trend of Aluminum PCBs especially owing to the motivation of LED industry. Therefore, it's necessary to be aware of some important features of Aluminum PCBs so that they can be better leveraged in your products or industry.
BGA, short for ball grid array, contains arrays of tin balls arranged in grid and its solder balls play a role as connection interface between packaging ICs and PCBs. Their connection is acquired through the application of SMT (surface mount technology). The definition of BGA has been released for almost 10 years and BGA package will be accepted by increasingly wider application fields due to its excellent thermal dissipation capability, electrical property and its compatibility with high-effici
Today I'm going to show you how to make simple customized PCB (printed circuit board). All you need are some materials and tools like: A PCB board, A bottle of Ferric Chloride, A mini drill, A small container, A bottle of thinner and Some plastic tweezers. Making your own circuit board only takes a snap, what you need is 30-45 minutes of time. Now, Let's kick off:
This paper addresses a production planning problem for printed Circuit board(PCB) assembly in a large-scale computer manufacturing company. A typical PCB assembly line for many Surface mounted devices(SMD) is shown in Fig. A standard SMD assembly line system consists of three main processes,namely,application of adhesive/solder,placement,and soldering.In detail, it can be divided into six operations.
The design standards of PCB Pad shape and size 1. The PCB Standard Packaging Library should be used.2. All pads should have a minimum of 0.25mm unilateral and a maximum total pad diameter not greater than 3 times the aperture of the part.3. It is important to ensure that the distance between the two pads is greater than 0.4mm.
The general process of hot air leveling process is: micro-etching → pre-heating → coating flux → spraying tin → cleaning.
Test is a very important part of PCB process in PCB manufacting, in order to improve the efficiency of PCB testing, then there PCB fly Needle test. Here we come to a simple understanding of the principle and the relevant methods and steps of flying probe test. Flying probe test is a check PCB electrical function (open short circuit test).
PCB (Printed Circuit Board) is an important electronic components, is the support of electronic components, electronic components are electrically connected to the carrier. Because it is electronic printing production, it is called "printed" circuit board. 10 steps will be introduced firstly as follows:
CCL each performance is mainly required to meet the PCB processing, application requirements from three aspects. These three aspects are: from printed circuit boards CCL aspects of the proposed performance requirements; the whole product from the operational aspects of the performance requirements set forth CCL; CCL from the installation components of the proposed performance requirements.