| iterms | description |
| Layers | 1-16 Layers for batch; 1-32 Layers for prototype and small run |
| Surface Finishing | HASl, HASL(Lead Free), Electrolytic gold, ENIG, immersion tin, immersion silver, OSP, Carbon Ink |
| PCB Thickness | 0.4-3.5mm |
| PCB Thickness tolerance | 10% |
| Material | CEM1,FR1,FR4,Rogers, |
| iterms | description |
| Min Tracing/Spacing | 3/3 mil for 0.5 OZ; 4/4 mil for 1 OZ; 5/5 mil for 2 OZ; 8/8 mil for 3 OZ; |
| Min Network Tracing/Spacing | 6/8 mil for 1OZ; 8/10 mil for 2OZ; 10/12 mil for 3OZ; |
| Min etching character width | 8 mil for 1OZ; 10 mil for 2 OZ; 12 mil for 3 OZ; |
| Min Bonding/BGA Pads | ≥6mil |
| Outside Copper Weight | 1OZ - 4 OZ |
| Inside Copper Weight | 0.5 OZ - 3 OZ; |
| wire to edge | ≥10mil |
Please contact us if you need more information.